logo LMSE
Laboratory of Microsensor Structures and Electronics
faks_logo
Faculty of Electrical Engineering
Home
Activities
Physics & device modelling
Semiconductor & MEMS technologies
Photolithography
Diffusion & oxidation
Wet etching & wafer cleaning
Thin film deposition & etching
Material and device characterization
Electronics
Devices
Projects
Equipment ARRS
Members
Contact
Lectures

Valid HTML 4.01 Strict


Difusion and oxidation
3 stacks of Tempress Omega Junior Diffusion Furnaces with 7 tubes

Stack No.ProcessGas
I.Boron depositionN2, H2, O2
Oxidation HYDROX (N2, O2, H2, TCA)
B drive-in, B reox.N2, O2, bubbler, TCA
II.Phosphor depositionN2, O2
P drive-in, PSG bake N2, O2, bubbler
LPCVD Si3N4SiH2C12, NH3, N2
III. Sinter, AlloyN2, H2

Solid diffusion sources:
  • p - type:
    • BN 975 from Carborundum, used with H2 injection
    • Boron Plus (GS 126, GS 139, GS 245) from Owens Illinois
  • n - type:
    • Phosplus TP 250, TP 360 from Owens Illinois
    • PH 900, PH 950, PH 1025 from Carborundum
Spinner
Diffusion furnaces