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Laboratory of Microsensor Structures and Electronics
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Faculty of Electrical Engineering
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Activities
Physics & device modelling
Semiconductor & MEMS technologies
•Photolithography
•Diffusion & oxidation
•Wet etching & wafer cleaning
•Thin film deposition & etching
Material and device characterization
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Deep Reactive Ion Etching
Plasmalab System 100 ICP 180
  • Inductive coupled plasma (ICP)
  • Lower (substrate) RF driven
  • Thermal contact by He backside cooling
  • Gas inlet through source and through distibution ring
Plasmalab 100
Plasmalab System 100

Technology
  • Bosch process - Si anisotropic etching
  • Resist removal
  • SiN, SiOx anisotropic etching

Gases
  • SF6
  • C4F8
  • Ar
  • O2
  • CHF3

PVD
PECVD
RIE
DRIE
Surface cleaning

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University of Ljubljana