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Laboratory of Microsensor Structures and Electronics
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Faculty of Electrical Engineering
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•Photolithography
•Diffusion & oxidation
•Wet etching & wafer cleaning
•Thin film deposition & etching
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Plasma-Enhanced Chemical Vapor Deposition
Plasmalab 80 Plus
  • 13.56 MHz driven parallel plate reactor
  • kHz and "frequency mixing" optional
  • substrate electrode: 240 mm
  • shower head gas inlet optimised for PECVD
  • 400° C substrate tables
Char 6
Plasmalab 80 Plus

Gases
  • N2
  • N2O
  • 5% SiH4 (N2)
  • NH3
  • CF4

Processes

Stress controlled layers of:
  • SiNx
  • SiOx
  • SiOxNy
  • a-Si

PVD
PECVD
RIE
DRIE
Surface cleaning

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University of Ljubljana